Umatshini wokushicilela wePad

Inkcazelo emfutshane:

IiNkcazo eziPhambili zobuGcisa

Ubungakanani beplate yentsimbi eqhelekileyo	100*250 mm
Oyile indebe ubukhulu	90 mm
Iradian yoshicilelo olukhulu	120°
Isantya esiphezulu sokubaleka	2200 amaxesha / iyure
Inguqulelo yentloko yerabha	125 mm
Ukunikezwa Amandla	I-AC220V 50/60Hz
Uxinzelelo lomoya	4-6 ibha
Imilinganiselo ngokubanzi	5507051255 mm
Ubunzima	65KG

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

1.Isicelo:

Umatshini wokushicilela we-pad luhlobo lwezixhobo zokushicilela, ezifanelekileyo kwiplastiki, iithoyi, iglasi, isinyithi, i-ceramic, i-electronics, i-IC seals, njl njl. ukuprintwa komphezulu kunye nokuhombisa izinto ezahlukeneyo.

Kubathengi abanohlahlo lwabiwo-mali olulinganiselweyo, esi sixhobo lukhetho olunoqoqosho kakhulu noluthembekileyo loshicilelo lwelogo kwindawo yebrake pad.

2.UmGaqo wokuSebenza:

Faka ipleyiti yentsimbi efaka ipateni eprintiweyo kwisihlalo sepleyiti yentsimbi yomatshini, kwaye wenze i-inki kwikomityi yeoli ikhuhle ngokulinganayo kwipatheni yepleyiti yentsimbi ngokusebenza ngaphambili nangasemva komatshini, kwaye emva koko udlulisele ipateni. kwisixhobo sokusebenzela esishicilelweyo ngokunyuka nokuhla kwentloko yerabha eshukumayo.

1. Indlela yokufaka i-inki kwi-etched plate

Zininzi iindlela zokusebenzisa i-inki kwipleyiti yensimbi.Okokuqala, fafaza i-inki kwi-plate, uze usule i-inki engaphezulu nge-scraper ekhishwayo.Ngeli xesha, i-solvent kwi-inki ekhohlo kwindawo echongiweyo iyajika kwaye yenza umphezulu we-colloidal, kwaye intloko yeglue iwela kwi-etching plate ukuze ifunxe i-inki.

2. Ukufunxa i-inki kunye neemveliso zokuprinta

Intloko yeglue iphakama emva kokufunxa ininzi ye-inki kwi-plate etching.Ngeli xesha, inxalenye yale maleko inki volatilizes, kwaye inxalenye eseleyo ye-inki umphezulu emanzi luncedo ngakumbi indibanisela esondeleyo into eprintiweyo kunye nentloko glue.Ubume bentloko yerabha kufuneka bukwazi ukuvelisa isenzo sokuqengqeleka ukukhupha umoya ogqithisileyo kumphezulu wepleyiti etshisiweyo kunye ne-inki.

3. Ukudibanisa inki kunye nentloko yeglue kwinkqubo yokuvelisa

Ngokufanelekileyo, zonke ii-inki kwi-etching plate idluliselwa kwinto eprintiweyo.Ngexesha lenkqubo yokuvelisa (ii-inks ezikufutshane ne-10 microns okanye i-0.01 mm ubukhulu zigqithiselwa kwi-substrate), ukuprintwa kwentloko enamathelayo kuchaphazeleka lula ngumoya, ubushushu, umbane ongatshintshiyo, njl. yonke inkqubo ukusuka kwi-etching plate ukuya kwintloko yokudluliselwa kwi-substrate, emva koko ukushicilelwa kuphumelele.Ukuba iphuphuma ngokukhawuleza kakhulu, i-inki iya koma ngaphambi kokuba ifunxe.Ukuba i-evaporation icotha kakhulu, umphezulu we-inki awukaveli i-gel, okungekho lula ukwenza intloko yeglue kunye ne-substrate ibambelele.

3.Iinzuzo zethu:

1. Iilogo zokushicilela kulula ukuzitshintsha.Yila iilogo kwiipleyiti zentsimbi, kwaye ufake iipleyiti zentsimbi ezahlukeneyo kwisakhelo, ungaprinta nawuphi na umxholo owahlukileyo ngokusetyenziswa okusebenzayo.

2. Inesantya esine sokushicilela ukukhetha.Intloko yerabha ehamba umgama kunye nobude zonke ziyakwazi ukulungelelanisa.

3. Siyila imo yokushicilela kwi-manual kunye nohlobo oluzenzekelayo.Umthengi unokuprinta iisampulu ngemodi yezandla, kunye noshicilelo oluninzi ngemo ezenzekelayo.