Isicelo:
Ukucombulula ipleyiti yangasemva emva kokusikwa kwelaser.Ukuba sebenzisa umatshini wokusika we-laser ukuvala kwaye wenze imingxunya, ubungakanani beplate yangasemva iya kuba nomahluko omncinci, ngenxa yoko sisebenzisa iziko lomatshini ukulungisa ipleyiti yangasemva njengesicelo sokuzoba.
PC Back Plate Production Flow
I-CV Back Plate Production Flow
Izinto zethu eziluncedo:
Ukuqina okuqinileyo: Isikhundla se-spindle seziko lomatshini elithe nkqo liphezulu, kwaye ipleyiti yangasemva ibotshelelwe kwibhentshi yokusebenzela, yenza inkqubo yomatshini ibe ngqongqo kwaye ikwazi ukuphatha iipleyiti ezingasemva ezintsonkothileyo kunye nemikhosi ephezulu yokusika.
Uzinzo oluhle lwe-machining: Ngenxa yesikhundla esiphezulu se-spindle yeziko lomatshini elithe nkqo, inkqubo yokucoca kunye nokusika i-plate yangasemva izinzile, nto leyo inceda ekuphuculeni ukuchaneka komatshini kunye nomgangatho womphezulu.
Ukusebenza ngokufanelekileyo: I-Workpiece clamping kunye nokutshintshwa kwesixhobo zonke ziqhutyelwa kumphezulu wokusebenza, okwenza kube lula kubaqhubi ukubeka iliso kunye nokugcina.
Unyawo oluncinci: Iziko lomatshini elithe nkqo linolwakhiwo olubambeneyo kunye nonyawo oluncinci ngokwentelekiso, elenza ukuba lilungele iindibano zocweyo ezinendawo encinci.
Iindleko eziphantsi: Ukuba sebenzisa umatshini wokubhoboza ngeplate yangasemva inkqubo elungileyo, kufuneka senze isitampu esisikiweyo sife ngemodeli nganye, kodwa iziko lomatshini lifuna kuphela i-clamp yokubeka iipleyiti zangasemva.Inokugcina utyalo-mali lokungunda kumthengi.
Ukusebenza okuphezulu: Umsebenzi omnye unokulawula iiseti ezi-2-3 zeziko lomatshini ngexesha elinye.